Test Development Engineer - Wafer Probe Testing

About the role

Cisco's Wafer Probe Test engineering team works on the Acacia products' wafer-level tests in contract manufacturing. The wafer probe test ensures each die assembled into the product meets standards, and the team collaborates with the US engineering team and the local contract manufacturer to solve complex engineering problems.

Key responsibilities

• Work with the US engineering team on new system, product and hardware qualification and tuning optimization in production.
• Develop scripts and tools to automate routine test tasks, data reporting and hardware diagnostic procedures.
• Oversee the design, characterization and maintenance of probe cards and associated load board hardware to ensure signal integrity.
• Analyze large-scale test data with Python and data-frame-based tools to identify yield limiters and implement process improvements.
• Partner with Design and Product Engineering teams to run root-cause analysis on test failures and silicon performance issues.

Required profile

• B.S. or M.S. in Electrical Engineering, Computer Engineering or a related field.
• At least 3 years of experience on wafer probing systems, with a good understanding of wafer-level testing methodologies.
• Excellent communication skills to coordinate with global cross-functional teams.

Required skills

• Hands-on experience with ATE platforms such as Advantest and Teradyne.
• Advanced proficiency in Python and Pandas for complex data manipulation.
• Preferred: understanding of PID control and the piezoelectric effect, and familiarity with JMP for data analysis.