Assembly Technical Program Manager

About the role

The Assembly Technical Program Manager drives cost competitiveness, process efficiency and BOM competitiveness across NXP’s assembly operations, leading strategic initiatives to achieve breakthrough cost reductions and enable next‑generation package architectures.

Key responsibilities

• Lead package cost transformation programs, optimizing low‑cost BOM and reducing assembly process costs.
• Develop and implement super‑wide leadframe and high‑density packaging solutions, and champion molding process efficiency improvements.
• Coach engineering teams, manage programs in a matrix environment, and engage strategically with suppliers to co‑develop innovative, cost‑effective materials and processes.
• Coordinate cross‑functional engagement with Business Lines on BOM changes, PCN success, and change‑management governance.

Required profile

• Bachelor’s or Master’s in Electronics, Electrical, Mechanical, Materials Engineering or related field.
• 10–18+ years of semiconductor assembly/packaging engineering experience.
• Proven leadership in cost reduction, value engineering, and global supplier collaboration.
• Strategic thinker with strong analytical, problem‑solving and executive‑level communication skills.

Required skills

• Bill of Materials (BOM) optimization
• Assembly process cost modeling
• QFN back‑end and leadframe‑based package technologies
• High‑density packaging design
• Molding process optimization
• PCN processes, JEDEC standards, qualification flows