PhD Intern - Hardware Development Engineering (Machining & Lapping)

About the role

Western Digital is looking for a Technical PhD Intern to support machining and lapping process development for next-generation wafer technologies. The role applies modeling, simulation, data analytics, AI/ML, software and hardware development to improve process capability, quality and manufacturing performance. The internship must last at least 4 months and can be on-site in Bang Pa-in or Ayutthaya.

Key responsibilities

• Support machining and lapping process development projects.
• Develop and apply modeling and simulation methods to understand process behavior.
• Analyze process and equipment data using statistical and AI/ML techniques.
• Assist in developing software tools, algorithms and engineering analytics solutions.
• Support experimental design, process characterization and root cause investigations.
• Collaborate with process, equipment, software and data engineering teams.
• Document and present technical findings and recommendations.

Required profile

• Currently pursuing a PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Computer Engineering, Physics, Data Science or an equivalent field.
• Internship of at least 4 months, on-site in Bang Pa-in or Ayutthaya.
• PREFERRED: research experience in machining, lapping, precision engineering, manufacturing processes or advanced materials.
• PREFERRED: knowledge of Design of Experiments (DOE), statistical analysis and process optimization.
• PREFERRED: familiarity with sensor systems, automation or hardware development.

Required skills

• Experience in modeling, simulation, data analysis or computational research.
• Experience with AI/ML, data analytics or predictive modeling.
• Programming in Python, MATLAB, C/C++ or similar.
• Strong analytical, problem-solving, teamwork and communication skills.
• Strong written and verbal English.