Senior Manager, Packaging Assembly Operation

About the role

Renesas Electronics is looking for an experienced Senior Manager of Semiconductor IC Packaging & Assembly Operations in Bangkok to lead high-volume assembly of advanced packaging technologies. The role converts qualified package technologies and NPI programs into predictable, scalable manufacturing that meets production output, customer delivery dates and revenue targets. It covers AI/data center power packaging (Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages) and wide-bandgap technologies (SiC, GaN, DBC, AMB), and works closely with Package Engineering, Quality, Supply Chain, Planning, Procurement and OSAT partners.

Key responsibilities

• Lead day-to-day semiconductor package assembly operations and drive daily, weekly and quarterly execution to meet output, delivery and revenue targets.
• Manage capacity, throughput, cycle time, yield, labor and equipment utilization, and run production reviews, bottleneck resolution and performance tracking.
• Own yield monitoring, trend analysis and corrective actions, and lead data-driven improvements to raise output, first-pass yield and reduce cycle time.
• Drive containment, corrective and preventive actions, support quality audits, and manage process changes, qualification plans and change control.
• Act as the interface for NPI-to-production ramp, covering equipment capacity, tooling, labor, BOM readiness and material risk mitigation.
• Manage global OSAT and contract manufacturing partners, including reviews, audits, benchmarking and qualification assessments.
• Lead and develop a global assembly engineering team, with talent development and succession planning.

Required profile

• Bachelor's degree in Electrical, Materials, Mechanical, Industrial Engineering, Operations Management, Supply Chain or a related field.
• 10+ years in semiconductor manufacturing, packaging or assembly operations, including IC assembly, NPI-to-HVM transfers and package qualification.
• 3+ years leading manufacturing, operations, engineering or cross-functional teams in semiconductor environments.
• Proven track record of NPI-to-HVM ramp execution and experience with global OSAT partners.
• Preferred: Master's or PhD, experience with 2.5D/3D packaging, SiP, fan-out, automotive/AI/data center products, and leading geographically distributed teams.

Required skills

• Wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT and advanced packaging.
• Yield analysis, SPC, DOE, reliability and process control, and statistical analysis tools.
• Quality systems, change management and qualification methodologies.